Conveyor for Printer Conveyor for
Pick & Place
Aligner Conveyor
for Reflow
Conveyor for Reflow

Aligner Conveyor
for Reflow

面板產業

Specifications 規格說明

Aligner  Equipment Hardware Configuration

Items

 Description

 Referential Spec

General

Aluminum alloy die casting(Anodizing)

W700 x L500 x H1380

Transport speed

180~1800mm/min

Transport weight

380mm

vacuum plant

operation function: 3 times action

Plant limit for (ABCD) face

plant positioning accuracy ±0.5mm

Power

AC 1 Φ 200/220V% ±10

Material Handling

Material

Glass, Si, MC wafer, Glass+MC wafer, Si+MC waferGlass+Si

Equipment Performance

Uptime

>95%

Wafer transfer failure rate

<10 PPM

Unscheduled downtime

<3% (By month)

Scheduled downtime

<2% (By month)

MTBF

> 500 hrs

MTBA

> 200hrs

MTBR

<3hrs

Critical parts coverage

100% local stock

WPH

30

 

 

 

 

Equipment Requirement

Conveyor width

Conveyor width adjustment (290 ~ 360mm)

Aligner

303mm±0.5mm

SUS Chamber encapsulated System

Fully SUS Chamber encapsulated System with low Nitrogen Atmosphere

Transport hight

920mm+/-20mm

Speed regulation and control per circuit

YES

Flatscreen monitor and signal tower

Three color

Color

White Paint

CE package including components - safety

YES

Temperature limit

<70

SMEMA

Interface for handling systems, SMEMA

聯絡資訊

06-5894793

06-5898101

chi.yeh@cykctec.com

(總部) 台南市善化區牛庄里牛庄131之3號

(二廠) 台南市善化區牛庄里牛庄131之6號

(三廠) 台南市新市區大社里大社588號

產品領域

PCB產業 面板產業 電子產業 物流產業 生醫產業 CCL產業 半導體產業
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