半導體產業
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Specifications |
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1.Basic |
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Dimension (2 Loadport) |
W2530 x L3000 x H2315 mm |
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Dimension (4 Loadport) |
W2530 x L4670 x H2315 mm |
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Weight |
220~300 kg |
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Panel/Wafer transfer size |
300x300 ~ 625x625 mm |
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FOUP Loader |
2 pcs / 4 pcs |
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SECS/GEM |
GEM200 / GEM300 |
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2.Power |
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控制系統負載 |
3P 208 VAC 50/60 Hz;75A |
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3.Non-Contact Alignment Ability |
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Product Size |
300x300 ~ 625x625 mm |
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Product Type |
Compound / Metal / Glass |
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Detection range |
±12mm |
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Detection accuracy |
±0.2mm |
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5.Transfer |
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Product Size |
300x300 ~ 625x625 mm |
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Product Size |
Compound / Metal / Glass |
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UPH |
100 pcs/hr |
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X axis accuracy |
±0.2mm |
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Robot Y axis accuracy |
±0.2mm |
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Robot Z axis accuracy |
±0.2mm |
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6.Quality |
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ESD |
< 25V |
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無塵等級 |
符合FS209 Class 100等級 |
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Vibration |
≦0.3G (RMS.) |
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7.Safety |
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SEMI 認證 |
符合SEMI S2、S8、S10認證 |
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設備結構認證 |
符合SEMI規範 |